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PB-03M is a BLE module developed by Shenzhen Ai-Thinker Technology Co., Ltd. The core processor chip PHY6252 (SSOP24) of this module is a BLE SoC with high integration and low power consumption, which is specially designed for various applications such as IoT, mobile devices, wearable electronic devices and smart homes. PHY6252 (SSOP24) chip has industry-leading low power consumption performance and RF performance, it supports BLE 5.2. The chip built in 64 KB SRAM, 256KB flash, 96 KBROM, 256bit efuse. The chip supports a variety of low-power working states and can meet the power consumption requirements of various application scenarios. RF output power can be adjusted to achieve the best balance among communication distance, communication rate and power consumption. PB-03M module provide rich peripheral interfaces, including UART, PWM, ADC, I2C, SPI, PDM, DMA and up to 15 IOs. PB-03M module has many unique hardware security mechanisms. Hardware encryption accelerator supports AES algorithm. PB-03M module supports BLE wit low power consumption: BLE 5.2 and BLE mesh. Bluetooth rate support: 125Kbps, 500Kbps, 1Mbps, 2Mbps. Support broadcast expansion, multi-broadcast, channel selection.
Features:
Support BLE5.2, rate support: 125Kbps, 500Kbps, 1Mbps, 2Mbps
Own 64 KB SRAM,256KB flash, 96 KB ROM,256bit efuse
Support UART/GPIO/ADC/PWM/I2C/SPI/PDM/DMA interface
Adopt DIP-18 Gold finger plugin package
Support multiple sleep modes, deep sleep current is less than 1uA
Support for serial local upgrade and remote Firmware upgrade (FOTA)
Universal AT instructions can be used easy and quickly
Support for secondary development, with an integrated Windows development environment
This website uses cookies, which are necessary for the technical operation of the website and are always set. Other cookies, which increase the usability of this website, serve for direct advertising or simplify interaction with other websites and social networks, will only be used with your consent. More information
